Die bonding machineMühlbauer
DS Variatio ECO W2W
Die bonding machine
Mühlbauer
DS Variatio ECO W2W
Year of construction
2023
Condition
Used
Location
Tallinn 

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Machine data
- Machine type:
- Die bonding machine
- Manufacturer:
- Mühlbauer
- Model:
- DS Variatio ECO W2W
- Year of construction:
- 2023
- Condition:
- excellent (used)
Price & Location
- Location:
- Valukoja tn 8/2, 11415 Tallinn, Estonia

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Details about the offer
- Listing ID:
- A204-93945
- Update:
- 10.11.2025
Description
2 identical machines available - both in great operational condition.
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Spec as following:
1 OS Variation ecoLINE Wafer to Wafer incl. 6" Wafer expander 1x
1.2 Flip Chip unit for chip rotation (up side down) 1x
1.3 Standard Die set up 1x
1.4 Vision System Wafer Station 1x
1.5 Sidewall Inspection with visible light incl. Side-illumination for Wafer Camera 1x
1. 6 Vision System Die on Fly Station 1
1. 7 Vision System Pre/Post Place Station 1
1.8 Vision System - Wafer/Place/OOF camera+ CDA version 1x
1. 9 Vision Image storage 1 x
1.10 Output Station: Reconstructed Wafer Indexer 1x
1.11 Jedec Tray Adapter Plate for W2W Indexer Output Station 1x
1.12 Magazine for Jedec Tray Adapter 1x
1.13 High accuracy Mode 1x
1.14 Automatic Wafer Changer up to 12 inch (pull version) 1x
1.15 Wafer mapping HW & SW excl. Host PC 1x
1.16 Adjustable Die Ejector in X, Y 1x
1. 17 Preparation for FFU filter upgrade on machine TOP housing and Output wafer changer, Hepa filter will be
provided by COA 1x
1.18 Vision upgrade according to offer 20140746 1
1.19 Software Upgrade according to offer 20141342 1x
1.20 2D Barcode Reader upgrade 1x
1.21 Label printer for reconstructed Wafer 1x
1.22 PalaMax Ready# incl. Palamax license 1x
Located within EU!
Fpodpsxvqx Hjfx Agmeb
Spec as following:
1 OS Variation ecoLINE Wafer to Wafer incl. 6" Wafer expander 1x
1.2 Flip Chip unit for chip rotation (up side down) 1x
1.3 Standard Die set up 1x
1.4 Vision System Wafer Station 1x
1.5 Sidewall Inspection with visible light incl. Side-illumination for Wafer Camera 1x
1. 6 Vision System Die on Fly Station 1
1. 7 Vision System Pre/Post Place Station 1
1.8 Vision System - Wafer/Place/OOF camera+ CDA version 1x
1. 9 Vision Image storage 1 x
1.10 Output Station: Reconstructed Wafer Indexer 1x
1.11 Jedec Tray Adapter Plate for W2W Indexer Output Station 1x
1.12 Magazine for Jedec Tray Adapter 1x
1.13 High accuracy Mode 1x
1.14 Automatic Wafer Changer up to 12 inch (pull version) 1x
1.15 Wafer mapping HW & SW excl. Host PC 1x
1.16 Adjustable Die Ejector in X, Y 1x
1. 17 Preparation for FFU filter upgrade on machine TOP housing and Output wafer changer, Hepa filter will be
provided by COA 1x
1.18 Vision upgrade according to offer 20140746 1
1.19 Software Upgrade according to offer 20141342 1x
1.20 2D Barcode Reader upgrade 1x
1.21 Label printer for reconstructed Wafer 1x
1.22 PalaMax Ready# incl. Palamax license 1x
Located within EU!
Seller
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